Description
Things to know before use
- Variations in the color and luster of the Engineering Plate appearance and the removal of the exposed metal areas are just minor adjustments to optimize the production process and surface quality. If the coating remains on the nozzle when the nozzle is wiped, it will be heated and melted before printing the model. Such changes do not affect leveling, Lidar, adhesion, or range of use. You can purchase with confidence!
- Before auto-leveling, it is necessary to repeatedly rub the nozzle in the special wiping area of the build plate to completely remove any residual material at the tip of the nozzle. The coating in the special-designed wiping area will gradually become worn over time. This is normal and does not affect print quality or nozzle lifetime, so there is no need to worry about any quality issues.
- Bambu Lab recommends only using Bambu Lab official glue on the Cool Plate, and can not be held responsible for any damage caused to plates as a result of using third-party glue on build plates.
Overview
- The Bambu Cool Plate is a sticker that is applied to the Bambu Engineering Plate. This is a consumable printing surface that is used in conjunction with a thin coat of glue stick and works best for filaments with a low heat deflection temperature
- The Bambu Cool Plate leaves a smooth finish to printed models that come in contact with the Cool Plate and might require a bit of post-processing for cleaning up the glue stick.
Recommended Settings for Bambu Cool Plate
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
| Hotbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? | |
| PLA/PLA-CF/PLA-GF | 35~45℃ | Yes | Either |
| TPU | 30~35℃ | Yes | Either |
| PVA | 35~45℃ | Yes | Either |
Benefits
- Works best with low glass transition temperature filaments as it can be used at a low temperature for the hotbed
- Works well with the Automatic Calibration for Flow rate and does not interfere with the LIDAR
- Smooth texture on the surface of the print
- Excellent adhesion and easy print removal
- Can be replaced by the user
Downsides
- Cannot be used without glue stick as the surface can be easily damaged if glue stick is not used
- It is not recommended for high-temperature materials as bubbles can form underneath the print surface and cause damage
- Can be more fragile compared to the Engineering Plate or Textured PEI Plate
Recommended Settings for Bambu Engineering Plate
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
| Hotbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? | |
| TPU | 30~35℃ | Recommended | No |
| PETG | 70~80℃ | Recommended | Yes |
| ABS | 100~110℃ | Yes | No |
| PC/PC-CF | 100~110℃ | Yes | No |
| PA/PA-CF/PATH-CF | 100~110℃ | Yes | No |
Installation Steps
Step 1: Align the plate with the fixed points of the platform with the name of the plate facing you
Step 2: Lower the plate and secure to the magnetic platform
Product Specification
| Surface temperature resistance | Up to 120℃ | Usable print size | 256*256 mm |
| Flexible spring steel thickness | 0.5 mm | Cool Plate sticker thickness | 0.4 mm |
| Package Weight | 320 g | Package size | 290*290*4 mm |
